Quality _Shenzhen Dragon Core Electronic Co.,Ltd

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Quality

Quality is greater than life

The quality of IC chips plays a significant role in the entire electronic product, directly affecting the quality issues of the entire product .

Poor quality raw materials will bring significant losses to production-oriented enterprises, and the chaos in the electronic components industry has existed for a long time. In the face of industry chaos, we have developed a meticulous quality inspection process, selecting original factories or authorized agents globally, as well as large-scale OCM and EMS as partners, starting from the source to control, cooperating with strict quality management processes and third-party professional testing institutions to minimize quality risks.

Our lifelong warranty commitment is built on the confidence of quality control, which stems from the strictest supplier screening, quality testing methods, and quality testing processes.

Strict Supplier Management Procedure
Comprehensive Quality Inspection Procedure
Professional 3rd party Electrical Testing
Life Time Warranty Commitment
ISO9001:2015 Certification Company

Quality Inspection Procedure

Packaging Inspection

Packaging Inspection
Inner and outer box checking.
Label condition checking.
Vacuum packaging checking.

Documents Review

Documents Review
Supplier's packing list checking.
Supplier's COC checking.
Manufacture COC checking.
Traceability documents checking.

Photo Evidences

Photo Evidences
Take photos of outer box.
Take photos of outer box.
Take photos of vacuum packaging.
Take photos of label.

Dimensional Measurement

Dimensional Measurement
Leads dimensional measurement.
Leads diameter measurement.
Leads pitches measurement.
Tape's width measurement.

Visual Inspection

Visual Inspection
Part body marking inspection.
Part body date code checking.
Part body LOT# checking.
Comparing with Golden Sample.
Leads oxidation inspection.

Label Verification

Label Verification
Original label Verification.
Full or erazed label checking.
Label & Part body D/C comparation.
Label & Part body LOT# comparation.

Requirements Verification

Requirements Verification
Verify MPN consistent with our PO.
Verify D/C consistent with our PO.
Verify COO consistent with our PO.
Verify QTY consistent with our PO.
Verify Remarks consistent with our PO.

Detailed Inspections

Detailed Inspections
Chip X-RAY Inspections.
DE-CAP Inspections.
Acetone and deep scrach test.
Other electrical performance tests

Inspection Finished

Inspection Finished
Finish In-house analysis report.
Finish In-house analysis report.
Send analysis report to customers.

Shipment Management Procedure

Parts Packing

Stick to MSL Packaging requirements
MSL 1: Anti-static bag
MSL 2: Desiccant + HIC + MBB
MSL 3: Desiccant + HIC + MBB
MSL 4: Desiccant + HIC + MBB

Labeling

1. Apply barcode labels with our company format.
2. Label contains customer PN.
3. Customers can scan for warehouse entry.

Package Protection

1. Each package is wrapped with bubble wrap
2. To prevent oxidation caused by air leakage during transportation.

Packaging

1. Reasonably box according to size.
2. Fill the vacant with bubble film to prevent logistics accidents

Outer box labeling

1. Stick the outer box label.
2. Put the packing list into the parcel
3. Facilitating fast delivery for customers

1Parts Packing

Stick to MSL Packaging requirements
MSL 1: Anti-static bag
MSL 2: Desiccant + HIC + MBB
MSL 3: Desiccant + HIC + MBB
MSL 4: Desiccant + HIC + MBB
2Labeling

1. Apply barcode labels with our company format.
2. Label contains customer PN.
3. Customers can scan for warehouse entry.
3Package Protection

1. Each package is wrapped with bubble wrap.
2. To prevent oxidation caused by air leakage during transportation.
4Packaging

1. Reasonably box according to size.
2. Fill the vacant with bubble film to prevent logistics accidents
5Outer box labeling

1. Stick the outer box label.
2. Put the packing list into the parcel.
3. Facilitating fast delivery for customers.